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2009 |
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Transaction on Civil Engineering |
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Transaction on Mechanical Engineering |
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Transactions on Chemistry and Chemical Engineering |
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Transaction on Computer Science & Engineering and Electrical Engineering |
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Transaction on Industrial Engineering |
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Transaction on Nanotechnology |
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Volume 16, Issue 3, 2009
Transaction on Mechanical Engineering
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Alumina-Copper Eutectic Bond
Strength: Contribution of Preoxidation,
Cuprous Oxides Particles and Pores
H. Ghasemi (PhD.)
M.A. Faghihi-Sani [PhD.]
A.H. Kokabi [PhD.]
Z. Riazi [PhD.]
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Abstract: The in
uences of cupric oxide layer thickness, cuprous oxide particles and pores on the
mechanical properties and microstructure of an alumina-copper eutectic bond have been investigated. The
furnace atmosphere in the rst stage was argon gas with 2 106 atm oxygen partial pressure. In the
second stage, the furnace atmosphere was the same as the rst stage except that the cooling interval was
between 900-1000C and the hydrogen gas was injected into the furnace atmosphere. Finally, in the last
stage, a vacuum furnace with 5 108 atm pressure was chosen for the bonding procedure. The peel
strength of rst stage specimens shows that a cupric oxide layer with 320 25 nm thickness generates
maximum peel strength (13:1 0:3 kg/cm) in the joint interface. In the second stage, by using hydrogen
gas, a joint interface free from any cuprous oxide particles was formed. In this case, the joint strength
has increased to 17:1 0:2 kg/cm. Finally, the bonding process in the vacuum furnace indicates that
the furnace gas does not have a considerable eect on joint interface pores. Furthermore, the bonding
process in the vacuum furnace reduces the peel strength of the joint due to the formation of more pores.
A thorough study of pore formation is presented.
Keywords: Alumina-copper |
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